Epoxy based moisture vapor barrier and primer

ABSTRACT

Two-component epoxy-based liquid formulations and their resultant dual use epoxy-based products. The epoxy-based liquid formulations include a liquid epoxy resin composition mixed with a liquid epoxy curing agent composition. The liquid epoxy resin compositions include one or more liquid epoxy resins containing a reactive oxirane structure or epoxide group, while the liquid epoxy curing agent composition comprises one or more epoxy curing agents. The liquid epoxy resin and liquid epoxy curing agent compositions are mixed together to provide a dual functioning epoxy-based formulation that, when applied to a substrate and cured, provides a cured three-dimensional cross-linked thermoset dual acting epoxy-based product having both the moisture vapor barrier and the primer functionalities.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention is directed to an epoxy-based product, and inparticular, to a dual use epoxy-based product that, when applied to asubstrate, acts as both a moisture vapor barrier and a primer.

2. Description of Related Art

Water, moisture or moisture vapor are destructive elements when notproperly controlled in the installation of flooring products onsubstrates that are susceptible to water seepage. Moisture permeatingfrom the underlying substrate can also present a problem for moisturesensitive floor coverings. All structures that may come into contactwith water must typically be protected from water seepage. In doing so,a waterproofing membrane is used to prevent the water, moisture ormoisture vapor seeping out of the underlying substrate from contactingthe overlying layers, such as, mortar, grout, tiles, etc.

In flooring installation, a waterproofing membrane is typically usedover concrete, masonry, terrazzo, cement backer boards, gypsum boards(interior wall use only) and exterior grade plywood. In allwaterproofing approaches, the moisture permeation of waterproofingmembranes, layers or barriers must be mitigated to an acceptable levelfor the floor coverings to function satisfactorily.

Conventionally, the underlying substrate is overlaid with a fluidapplied waterproofing membrane, covered with a reinforcing fabric andthen overlaid with another layer of the fluid waterproofing membrane.Other methods employ a waterproofing membrane sheet. A mortar is thenapplied over the waterproofing membrane surface and provides the basefor installing ceramic tile. A grout is then used between the openingsin the ceramic tile.

Another popular approach is to use formulated compositions that providea waterproofing layer or barrier, in combination with a self-levelingunderlayment. Known waterproofing barrier approaches utilize formulatedcompositions of two-component resin-based products that each form amembrane to mitigate the moisture issue, as specified in ASTM F3010.However, when known two-component resin-based products are used onconcrete substrates, and a cementitious product such as cement basedself-leveling underlayment is to be installed on the moisture mitigationbarrier or layer, a primer, such as emulsion-based primer, isrecommended to enhance adhesion and bonding between the self-levelingunderlayment to the moisture mitigation barrier or layer.

Typically, high-solids epoxy primers or acrylic primers in combinationwith broadcast sand are employed to provide a suitable bonding surfacefor the overlying layer. In this process the primer is prepared and thenrolling onto the flooring surface. While the primer is wet, a bed ofsand is broadcast onto and into the primer layer so that the broadcastsand fully covers the primer layer. This bed of broadcast sand isrequired for the bonding and adhesion of the overlying layer to theprimer layer. Once the wet primer layer is fully broadcast and coveredwith sand, the primer layer and sand overcoat must be cured until set ordry. In addition to this time, the subsequent curing process is timeconsuming, often taking between 12-24 hours or more, until the primerlayer and sand are fully cured.

After the primer layer and sand overcoat are fully cured, excess sandmust then be removed from the cured surface. This step is very timeconsuming and labor intensive taking a day or more to complete sinceexcess sand must be removed by surface scraping and then vacuuming. Itis also often necessary to repeat this sand removal step several timesuntil it is determined that the sand has been sufficiently removed.Another drawback of this step is that it releases particulate matterinto the air, which may be hazardous to the worker's health (i.e.,installer). For instance, health hazardous silica particles may becomeairborne and detrimentally inhaled by such workers, which are currentlyregulated and controlled by OSHA Regulations.

The use of self-leveling underlayments and polishable overlays haveincreased in popularity. Known methods and systems for applying layersover a primer/broadcast sand layer are less than ideal since theygenerate industry wide problems for manufacturers, installers (i.e.,workers), and the end users. Also, in applying the layers (e.g.,self-leveling underlayments, polishable overlays, etc.) over the epoxyprimer/sand broadcast layer, if all loose sand is not removed from theflooring surface prior to application of the overlying layer, thenunwanted debonding occurs between the primer/sand broadcast layer andsuch overlying layer. There is also loss of bonding due to the curlingnature during the curing process of cement-based products. The sideeffects that occur from this delamination include a hollow soundingfloor and cracking, both of which are less than ideal in the final endproduct.

There continues to be a need for new and improved epoxy-based productsimproved methods, and systems for easily, time efficiently, and safelyapplying layers over a flooring or substrate surface, for which thepresent invention provides a solution thereto.

SUMMARY OF THE INVENTION

Bearing in mind the problems and deficiencies of the prior art, it istherefore an object of the present invention to provide a dual useepoxy-based product that, when applied to a substrate, acts as both amoisture vapor barrier and a primer.

Another object of the present invention is to provide an epoxy-basedproduct that eliminates the additional primer step.

It is another object of the present invention to provide methods ofapplying layers over a dual use epoxy-based product without the need fora primer layer.

A further object of the invention is to provide systems of applyinglayers over a dual use epoxy-based product without the need for a primerlayer.

It is another object of the present invention to provide a method formaking an improved waterproofing membrane composition and a method forusing the waterproofing membrane composition of the invention.

It is yet another object of the present invention to provide dual useepoxy-based products having reduced hazardous health risks duringapplication thereof.

Another object of the present invention is to provide dual useepoxy-based products that are cost efficient and provide strong, durabledried products.

A further object of the invention is to provide methods and systems foreasily, time efficiently, and safely applying layers (e.g.,self-leveling underlayments, polishable overlays, etc.) over a flooringor substrate surface that eliminate the additional primer steps.

Still other objects and advantages of the invention will in part beobvious and will in part be apparent from the specification.

The above and other objects, which will be apparent to those skilled inthe art, are achieved in the present invention which is directed to atwo-component epoxy-based liquid formulation comprising a liquid epoxyresin composition and a liquid epoxy curing agent composition. Theliquid epoxy resin composition comprises one or more liquid epoxy resinscontaining a reactive oxirane structure or epoxide group, while theliquid epoxy curing agent composition comprises one or more epoxy curingagents. The liquid epoxy resin composition and the liquid epoxy curingagent composition are mixed together to provide a dual functioningepoxy-based formulation that, when applied to a substrate and cured,simultaneously acts as both a moisture vapor barrier and a primer.

In one or more embodiments the reactive oxirane structure or epoxidegroup has a structure comprising

The one or more liquid epoxy resins may include one or more bisphenolbased liquid epoxy resins, such as, a bisphenol-A liquid epoxy resin, adiglycidyl ether of bisphenol A, a bisphenol F, a liquid bisphenol-A/Fresin blend, or an aliphatic glycidyl ether reactive diluent, modifiedliquid epoxy resin.

The one or more liquid epoxy resins may be one or more C12-C14 aliphaticchain glycidyl ether reactive diluent, modified bisphenol-A/F basedliquid epoxy resins. In particular, the one or more liquid epoxy resinsmay be one or more C12-C14 aliphatic chain glycidyl ether reactivediluents having the reactive oxirane structure or epoxide groupcomprising diglycidyl ether of bisphenol A, or bisphenol F, or a liquidbisphenol-A/F resin blend.

The liquid epoxy resin composition may further include a reactive or anon-reactive diluent comprising a bisphenol based liquid epoxy resin.For instance, the bisphenol based liquid epoxy resin may include adiglycidyl ether of bisphenol-A, a bisphenol-A liquid epoxy resin, abisphenol-F based liquid epoxy resin, a liquid bisphenol-A/F resinblend, an aliphatic glycidyl ether reactive diluent modified liquidepoxy resin, or an aliphatic glycidyl ether reactive diluent, modifiedliquid epoxy resin.

The liquid epoxy resin composition may further include an epoxyfunctional reactive diluent selected from the group consisting of anaromatic glycidyl ether, aliphatic glycidyl ether, glycidyl amine, orglycidyl ether. The epoxy functional reactive diluent may be adiglycidyl ether comprising 1,4 butanediol diglycidyl ether aliphaticdifunctional modifier that is an epoxy reactive diluent. The liquidepoxy resin composition may also include adhesion promoters, defoamers,wetting and dispersing additives, pigments and/or fillers.

In one or more embodiments the liquid epoxy resin composition mayinclude one or more liquid epoxy resins comprising one or more bisphenolbased liquid epoxy resins (in an amount ranging from 80-100 wt. %), anepoxy functional reactive diluent comprising a diglycidyl ether (in anamount ranging from 0-20 wt. %), an adhesion promoter comprising aγ-Glycidoxypropyl-trimethoxy silane coupling agent (in an amount rangingfrom 0-3 wt. %), a defoamer comprising a naphtha (petroleum) heavyalkylate defoamer (in an amount ranging from 0-1 wt. %), a wetting anddispersing additive comprising a silicone acrylate copolymer (in anamount ranging from 0-1 wt. %), pigment (in an amount ranging from 0-2wt. %), and one or more fillers (in an amount ranging from 0-20 wt. %).The weight percentages are based on a total weight of the liquid epoxyresin composition.

In the present two-component epoxy-based liquid formulations, the one ormore epoxy curing agents of the liquid epoxy curing agent compositionmay include liquid polyamines, polyamine adduct curing agents, and/oraliphatic amines. The liquid epoxy curing agent composition may be amixture of a first epoxy curing agent being a solvent-free modifiedaliphatic amine and a second epoxy curing agent being a modifiedpolyamine curing agent.

In one or more embodiments the liquid epoxy curing agent composition mayinclude the one or more epoxy curing agents comprising one or moreliquid polyamine (R-NH₂) epoxy curing agents (in an amount ranging from80-100 wt. %); a catalytic curing agent comprising tertiary amines in anamount ranging from 0-5 wt. %); an adhesion promoter comprisingdiaminofunctional silanes (in an amount ranging from 0-3 wt. %); adefoamer (in an amount ranging from 0-1 wt. %); a wetting and dispersingadditive (in an amount ranging from 0-1 wt. %); pigment (in an amountranging from 0-2 wt. %); and one or more fillers (in an amount rangingfrom 0-20 wt. %).

In other embodiments the liquid epoxy resin composition may include theone or more liquid epoxy resins being one liquid epoxy resin comprisinga mixture of: xirane,2,2′-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis-,homopolymer; a formaldehyde polymer having (chloromethyl)oxirane andphenol; and an alkyl (C12-14) glycidyl ether; a reactive diluent being abisphenol based liquid epoxy resin comprising oxirane,2,2′-[1,4-butanediylbis(oxymethylene)]bis; and a defoamer comprisingnaphtha (petroleum) heavy alkylate. In these embodiments, the one ormore liquid epoxy resins may include a first epoxy curing agentcomprising a mixture of: 4-tert-butylphenol;4,6-Tri(dimethylaminomethyl)phenol; and methyl alcohol, mixed with asecond epoxy curing agent comprising a mixture of: phenol4-nonyl-branched; 1,3-benzenedimethanamine; benzyl alcohol; and phenol,in combination with an adhesion promoter comprising a diaminofunctionalsilane.

In embodiments of the invention, the liquid epoxy resin composition andthe liquid epoxy curing agent composition may be mixed together in astoichiometric ratio ranging from 1.5:1.0 to 3.4:1.0 to provide the dualfunctioning epoxy-based formulation. When the dual functioningepoxy-based formulation is applied to the substrate, the liquid epoxyresin composition and the liquid epoxy curing agent composition reactwith each other to provide a cured three-dimensional cross-linkedthermoset dual acting epoxy-based product having both the moisture vaporbarrier and the primer functionalities.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the invention believed to be novel and the elementscharacteristic of the invention are set forth with particularity in theappended claims. The figures are for illustration purposes only and arenot drawn to scale. The invention itself, however, both as toorganization and method of operation, may best be understood byreference to the detailed description which follows taken in conjunctionwith the accompanying drawings in which:

FIG. 1 is a comparative graph showing the beneficial results of theinvention, whereby adhesion strengths of prior art products are comparedto a dual acting epoxy-based formulation in accordance with theinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

In describing the preferred embodiment of the present invention,reference will be made herein to FIG. 1 of the drawings in which likenumerals refer to like features of the invention.

The various embodiments of the invention are directed to dual actingepoxy-based formulations, and their resultant products, that act as botha moisture vapor barrier and a primer, simultaneously. Working as amoisture vapor barrier, the present cured layers of the invention meetthe ASTM F3010 Standard Practice for two-component resin-basedmembrane-forming moisture mitigation systems for use under resilientfloor coverings. Simultaneously, working as a primer the present curedlayers of the invention promote direct adhesion and bonding between thesubstrate (e.g., flooring) and the subsequently deposited cementitiousproducts (e.g., mortars, self-leveling underlayments, polishableoverlays, etc.). The term “mortar” will be used herein to refer tothin-set mortars, medium bed mortars, underlayment or leveling mortarsand grouts and pointing mortars.

The embodiments of the present invention can comprise, consist of, andconsist essentially of the features and/or steps described herein, aswell as any of the additional or optional ingredients, components,steps, or limitations described herein or would otherwise be appreciatedby one of skill in the art. It is to be understood that allconcentrations disclosed herein are by weight percent (wt. %.) based ona total weight of the composition, or each particular composition,unless otherwise indicated.

In accordance with the various embodiments of the invention, theinvention avoids, or makes it not necessary, to apply a primer layer(e.g., an epoxy primer layer) and/or a broadcast sand layer over theprimer layer (e.g., primer/sand broadcast layer). As such, the inventionavoids the need to wait for such primer/sand broadcast layers to cure,and the need for removal of any residual sand from the surface thereof.The invention avoids the time it takes to apply a primer layer,broadcasting of sand into and onto such primer layer, cure time, andsubsequent excess sand removal time are avoided. Also avoided is thedetrimental health side-affects caused by these steps, as well as thedebonding or delamination between a primer/sand broadcast layer and asubsequently deposited layer.

In accordance with the invention, one or more embodiments are directedto dual acting epoxy-based formulations that are each suitable and actas both a moisture vapor barrier and a primer when applied over asubstrate susceptible to water, moisture, moisture vapor seepage. Forease of understanding the invention, reference is made herein tomoisture, however, it should be understood that the term ‘moisture’refers to water, moisture, moisture vapor, liquid, or another othermaterial that is able to wet and damage a substrate (e.g., flooring).

The various moisture vapor barrier and primer epoxy-based formulationsare formulated initially as a two-component liquid system that is mixedtogether prior to use to form the instant epoxy-based formulations. Thetwo-component liquid system includes a liquid epoxy resin composition(Part A) and a liquid epoxy curing agent composition (Part B).

Part A: The liquid epoxy resin composition (Part A) preferably includesany liquid epoxy resins that contain(s) or include(s) the reactiveoxirane structure or epoxide group as follows:

For instance, in one or more embodiments the preferred liquid epoxyresin may be diglycidyl ether of bisphenol A, or bisphenol F, or amixture of bisphenol A and bisphenol F. In these embodiments a reactiveor a non-reactive diluent may be added to the liquid epoxy resincomposition (Part A) to reduce overall viscosity of the composition.Suitable liquid epoxy resin components of the invention may include, butare not limited to, bisphenol based liquid epoxy resins. The bisphenolbased liquid epoxy resins suitable for use in the present inventioninclude, but are not limited to, a diglycidyl ether of bisphenol-A; alow viscosity, undiluted, bisphenol-A liquid epoxy resin; a lowviscosity, undiluted, bisphenol-A liquid epoxy resin; a standard,bisphenol-F based liquid epoxy resin; a low viscosity, liquidbisphenol-A/F resin blend; a low viscosity, liquid bisphenol-A/F resinblend; and/or an aliphatic glycidyl ether reactive diluent, modifiedliquid epoxy resin.

In one or more preferred embodiments, the liquid epoxy resin componentof the liquid epoxy resin composition (Part A) may include a bisphenolbased liquid epoxy resin that is a C12-C14 aliphatic chain glycidylether reactive diluent, modified bisphenol-A/F based liquid epoxy resin.For instance, the liquid epoxy resin component within the liquid epoxyresin composition (Part A) of the invention may be a C12-C14 aliphaticchain glycidyl ether reactive diluent having a reactive oxiranestructure or epoxide group, diglycidyl ether of bisphenol A, orbisphenol F, or a mixture thereof.

The reactive diluent within the liquid epoxy resin component lowers boththe viscosity and the surface tension in the liquid epoxy resincomposition to provide improved surface wetting (ease of contacting andspreading over a given substrate) and adhesion to both the liquid epoxyresin composition (Part A) and the resultant dual acting epoxy-basedformulations of the invention. The reactive diluent also increases potlife and flexibility (impact resistance) to the (Part A) composition andthe overall resultant epoxy-based formulations of the invention.

In a preferred embodiment, the liquid epoxy resin component may includein combination: xirane,2,2′-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis-,homopolymer (present in the epoxy resin component in amount from about61-71 wt. %); a formaldehyde, polymer with (chloromethyl)oxirane andphenol (present in the epoxy resin component from about 14-24 wt. %);and alkyl (C12-14) glycidyl ether (present in the epoxy resin componentfrom about 9-19 wt. %), whereby all weight percentages are based on atotal weight of the epoxy resin component. This liquid epoxy resincomponent may be present within the liquid epoxy resin composition (PartA) of the invention in an amount from about 84-100 wt. %, based on atotal weight percentage of Part A.

The liquid epoxy resin composition (Part A) of the invention alsoincludes a diluent. The diluent may include any reactive diluent that isa monomer and modifier used in epoxy formulations to reduce viscosityand improve handling, processing, and application properties offormulations. The chemistries of suitable epoxy reactive diluents foruse in the invention include, but are not limited to, aromatic glycidylethers, aliphatic glycidyl ethers, glycidyl amines, glycidyl esters, andvarious other mono-epoxy functional to multi-epoxy functionalconstituents. In one or more preferred embodiments, suitable reactivediluent components for use in the invention may include, but are notlimited to, aliphatic diglycidyl ethers that act as epoxy functionalmonomers and modifiers. For instance, the reactive diluent may include alow viscosity, aliphatic diglycidyl ether comprising 1,4 butanedioldiglycidyl ether aliphatic difunctional modifier that is an epoxyreactive diluent, and in particular those suitable for use as a reactivediluent for high viscosity epoxy resins.

In the preferred embodiment, the reactive diluent component of Part Amay include oxirane, 2,2′-[1,4-butanediylbis(oxymethylene)]bis-, presentin the liquid epoxy resin composition (Part A) of the invention in anamount from about 4.8-5.0 wt. %.

Also included in the liquid epoxy resin composition (Part A) of theinvention is an adhesion promoter constituent. The adhesion promoter mayinclude any composition or material that is known to promote adhesion inepoxy resin compositions. In one or more embodiments the adhesionpromoter may be an epoxy functional silane-based cross-linking,coupling, or curing agent. The epoxy functional silane coupling agentsare reactive with epoxy to enhance adhesion and increase strength of theepoxy resin compositions. For instance, a suitable silane-based adhesionpromoter may include a γ-Glycidoxypropyl-trimethoxy silane couplingagent that has both organic and inorganic reactivity, and impartssuperior adhesion and strength properties to the liquid epoxy resincomposition (Part A) of the invention.

A defoamer and/or wetting and dispersing additives may also be includedwithin the instant liquid epoxy resin compositions (Part A). Thedefoamer may includes those defoamers capable of destroying polymers andpolysiloxane foams. In one or more embodiments the defoamer may be basedon silicones and polymers for solvent-free and solvent-borne adhesivesand sealants. A suitable defoamer for use in the present invention maybe a defoamer based on silicones and polymers, such as, naphtha(petroleum) heavy alkylate defoamers. The wetting and dispersingadditives provide the instant liquid epoxy resin compositions (Part A)with a strong reduction in the surface tension of the wet coating. Inone or more embodiments the wetting and dispersing additives may be asurface-active additive based on a silicone acrylate copolymer, such as,2-methoxypropyl-1-acetate which is a solution of a silicone-modifiedpolyacrylate. Both the defoamers and wetting/dispersing additives may beadded to the instant liquid epoxy resin composition (Part A) to providethe resultant dual acting epoxy-based formulations and cured films ofthe invention with increased film quality and performance.

In the preferred embodiment, the defoamer component of Part A mayinclude naphtha (petroleum) heavy alkylate, present in the liquid epoxyresin composition (Part A) of the invention in an amount from about0.192-0.194 wt. %. The wetting/dispersing agent may be2-methoxypropyl-1-acetate present in the Part A component in an amount<=0.001 wt. %.

The liquid epoxy resin compositions (Part A) of the invention mayfurther include one or more additional constituents, either singly or invarious combinations with one another, to provide the liquid epoxy resincompositions (Part A) with desired properties, characteristic and/orattributes. These one or more additional constituents include, but arenot limited to, pigment(s) to provide different colors to the resultantcured film of the invention, and filler(s) such as quartz sand and micawhich may be beneficial in reducing costs and/or helping mitigatemoisture vapor transmission.

In accordance with one or more embodiments of the invention, variousformulations of the present liquid epoxy resin compositions (Part A) ofthe invention are described below in Table 1:

TABLE 1 Liquid Epoxy Resin Composition (Part A) Composition/ PreferredRange Most Preferred Property Range (wt. %)* (wt. %)* Range (wt. %)*Liquid epoxy resin  40-100 wt. %  80-100 wt. %  >90-100 wt. %   Epoxyfunctional  0-50 wt. %  0-20 wt. %  0-10 wt. % reactive diluent Adhesion 0-10 wt. % 0-3 wt. % 0-1 wt. % promoter Defoamer 0-5 wt. % 0-1 wt. %  0-0.5 wt. % Wetting and 0-5 wt. % 0-1 wt. %   0-0.5 wt. % dispersingadditive Pigment 0-6 wt. % 0-2 wt. % 0-2 wt. % Filler  0-60 wt. %  0-20wt. %  0-10 wt. % TOTAL 100 wt. % 100 wt. % 100 wt. % FORMULATION *Rangeweight % based on total weight of resultant liquid epoxy resincomposition (Part A)

Part B: The second component of the present two-component liquid systemcomprises the liquid epoxy curing agent composition (Part B). The liquidepoxy curing agent composition (Part B) may include one or more epoxycuring agent(s) having molecules containing a reactive hydrogen(s) thatwill react with the epoxide groups of the liquid epoxy resin composition(Part A). These epoxy curing agents may include, but are not limited to,polyamines, polyamine adduct curing agents and aliphatic amines. In oneor more embodiments, the preferred liquid epoxy curing agents includeliquid polyamines (R-NH₂), or their modifications, or their adducts,which are capable of reacting with the liquid epoxy resin componentresiding within the liquid epoxy resin composition (Part A) at ambienttemperature.

While not meant to limit the invention, in one or more embodiments ithas been found that two or more epoxy curing agents in combination aresuitable for use as the liquid epoxy curing agent composition (Part B)of the invention. The combination of the first and second epoxy curingagents provide the resultant dual acting epoxy-based formulations of theinvention with dual functionalities of acting as both a moisture vaporbarrier and a primer, thereby avoiding the need to subsequently applyinga primer layer.

The first epoxy curing agent may be a solvent free modified aliphaticamine suitable for use at ambient and low temperatures. The first epoxycuring agent may provide a fast cure rate, low temperature curing, ismoisture tolerant, offers chemical resistant, and has low VOC andemissions, all while providing flooring systems with moisture vaporbarrier protection. The second epoxy curing agent may be a modifiedpolyamine curing agent having properties including, but not limited to,a fast cure rate, low temperature curing, high hardness, high tensilestrength, and high tear strength.

In the preferred embodiment, the first epoxy curing agent of the liquidepoxy curing agent composition (Part B) may include in combination:4-tert-butylphenol (present in Part B in amount from about 4-12 wt. %);4,6-Tri(dimethylaminomethyl)phenol (present in Part B in amount fromabout 0.6-3.0 wt. %); and methyl alcohol (present in Part B in an amount<0.01 wt. %), whereby all weight percentages are based on a total weightof the liquid epoxy curing agent composition (Part B). The second epoxycuring agent of the liquid epoxy curing agent composition (Part B) mayinclude in combination: Phenol, 4-nonyl-, branched (present in Part B inamount from about 9-24 wt. %); 1,3-benzenedimethanamine (present in PartB in amount from about 9-22 wt. %); benzyl alcohol (present in Part B inamount from about 5-10 wt. %); and phenol (present in Part B in amountfrom about 3-6 wt. %), whereby all weight percentages are based on atotal weight of Part B. The first and second epoxy curing agents arecombined to provide the instant liquid epoxy curing agent composition(Part B).

The liquid epoxy curing agent composition (Part B) may also include anumber of different additives including, but not limited to, catalyticcuring agent(s), adhesion promoter(s), defoamer(s), wetting anddispersing additive(s), pigment(s) and filler(s). The catalytic curingagents, such as tertiary amines, may be added to facilitate the curingreaction with the liquid epoxy resin composition (Part A). A variety ofknown catalytic curing agents may be used in the present liquid epoxycuring agent composition (Part B) to achieve the desired performance.

In one or more embodiments adhesion promoter(s) are preferred in theliquid epoxy curing agent composition. These adhesion promoter(s) mayinclude diaminofunctional silane(s) to improve the adhesion ofamino-reactive resins to surfaces. For instance, in certain embodimentsof the invention a preferred adhesion promoter is a hydrophobicdiaminofunctional silane characterized by having randomly distributedlinear and cyclic oligosiloxanes.

In accordance with one or more embodiments of the invention, variousformulations of the present liquid epoxy curing agent composition (PartB) of the invention are described below in Table 2:

TABLE 2 Liquid Epoxy Curing Agent Composition (Part B) Composition/Preferred Range Most Preferred Property Range (wt. %)* (wt. %)* Range(wt. %)* One or more liquid  50-100 wt. %  80-100 wt. % >90-100 epoxycuring (combined amount (combined amount wt. % agent(s) of one or moreof one or more epoxy curing) epoxy curing) Catalytic curing  0-20 wt. %0-5 wt. % 0-3 wt. % agent Adhesion  0-10 wt. % 0-3 wt. % 0-2 wt. %promoter Defoamer 0-5 wt. % 0-1 wt. %   0-0.5 wt. % Wetting and 0-5 wt.% 0-1 wt. %   0-0.5 wt. % dispersing additive Pigment 0-6 wt. % 0-2 wt.% 0-2 wt. % Filler  0-60 wt. %  0-20 wt. %  0-10 wt. % TOTAL 100 wt. %100 wt. % 100 wt. % FORMULATION *Range weight % based on total weight ofliquid epoxy curing agent composition (Part B)

For the various liquid epoxy resin composition(s) (Part A) and liquidepoxy curing agent composition(s) (Part B) described above, eachcomposition may be separately mixed by combining theconstituents/ingredients thereof in any order. For instance, theingredients of the liquid epoxy resin component or the curing agentcomponent may be added in any sequence in a mixer that enableshomogeneous mixing. Optionally, the pigment and/or filler(s) may beadded or supplied as third component compositions. The completed Part Acomposition and Part B composition may be stored prior to use informulation the resultant dual acting epoxy-based formulations of theinvention.

Once the liquid epoxy resin composition (Part A) and liquid epoxy curingagent composition (Part B) are completed, these two-component liquidsystems are then mixed together to form the resultant dual actingepoxy-based formulations of the invention. Preferably, the Part A andPart B compositions are mixed just prior to use of the formed dualacting epoxy-based formulation. In mixing these Part A and Part Bcompositions, the amounts or ratios of mixing Part A to Part Bcompositions is based on the stoichiometric ratio of the individualreactive ingredients within each composition, along with the percentagesof such ingredients within the two compositions. In determining thestoichiometric ratio, it will be appreciated by one skilled in the artthat each reactive material has different equivalent weight which isused to calculate the stoichiometric ratio.

In one or more embodiments of the invention the stoichiometric ratio ofmixing Part A to Part B may range from about 1.5(Part A):1.0(Part B) to3.4(Part A):1.0(Part B). In certain embodiments it has been found thatthe ratio of Part A to Part B compositions may be up to 30% off thestoichiometric ratio in order to obtain high adhesion with bothunderlying and overlying cementitious products. Any higher percentagesoff the stoichiometric ratio is undesirable as the resultant dual actingepoxy-based formulations of the invention will not meet the moisturevapor transmission rate criteria specified in the ASTM F3010 standard.As a result of mixing Part A to Part B in these stoichiometric ratios,the formed dual acting epoxy-based film/layer product of the inventionhas both vapor barrier and primer functionalities.

Upon mixing the desired ratio of liquid epoxy resin composition (Part A)to liquid epoxy curing agent composition (Part B), the resultant dualacting liquid epoxy-based formulation of the invention is formed. Thisformulation is applied over a surface, whereby the epoxy resin andcuring agent react with each other to provide a cured, resultantthree-dimensional cross-linked thermoset dual acting epoxy-based productof the invention. This cured dual acting epoxy-based product of theinvention may be a layer or film having a three-dimensional structurethat is dense enough to block the passage of moisture or moisture vaporto an extent that meets the stringent ASTM F3010 standard.

In addition, the final cured dual acting epoxy-based product is providedwith adhesion promoters, either via the Part A composition, the Part Bcomposition, or both, to increase adhesion of such final cured dualacting epoxy-based product with a subsequently deposited cementitiousmaterial (e.g., mortar, grout, etc.) without the need or use of a primerand the additional steps associated therewith. In accordance with one ormore embodiments of the invention, silane adhesion promoters are addedto either the liquid epoxy resin composition (Part A), the liquid epoxycuring agent composition (Part B), or both the Part A and Part Bcompositions to further increase the adhesion. In doing so, thesubsequently deposited cementitious materials bond with the cured dualacting epoxy-based film/layer product of the invention (e.g., throughhydrogen bonding) without the need for a primer layer. As such, theresultant cured dual acting epoxy-based film/layer product of theinvention functions both as a moisture vapor barrier and a primer.

Thus, the present invention eliminates the additional need for a primerstep, as discussed in detail above. The various embodiments of theinvention advantageously overcome the above problems by providingmethods, dual acting epoxy-based formulations and their cured dualacting epoxy-based products (e.g., films) that are applied faster,easier, more time efficiently, and safer than known approaches requiringuse of primer layers and/or sand blasting. It has been found that thepresent dual acting epoxy-based films of the invention combine moisturemitigation and primer into a single product, while eliminating thepriming step at a job site.

While not meant to be limiting, one or more examples of the inventionare described in detail below.

EXAMPLE 1A Liquid Epoxy Resin Composition (Part A)

Composition/ Property Weight %* Liquid epoxy 89.0 wt. % resins Epoxyfunctional 10.0 wt. % reactive diluent Adhesion 0.44 wt. % promoterDefoamer 0.44 wt. % Wetting and  0.2 wt. % dispersing additive TOTAL 100 wt. % FORMULATION *Range weight % based on total weight ofresultant liquid epoxy resin composition (Part A)

EXAMPLE 1B Liquid Epoxy Curing Agent Composition (Part B)

Composition/ Property Weight %* Liquid epoxy 99.0 wt. % curing agentsAdhesion  1.0 wt. % promoter TOTAL  100 wt. % FORMULATION *Range weight% based on total weight of the liquid epoxy curing agent composition(Part B)

In Examples 1A and 1B, the Part A and Part B compositions are mixed atthe stoichiometric ratio of 2.0 to 1. The formulated dual actingepoxy-based liquid was applied to a concrete substrate using knowntechniques to a thickness of about 16 mil. The deposited dual actingepoxy-based liquid was allowed to fully cure to provide a cured dualacting epoxy-based film having both moisture vapor barrier propertiesand primer properties. In the resultant cured dual acting epoxy-basedfilm, the moisture vapor transmission rate was measured at 0.09 perms at16 mil according to the water method of ASTM E 96 Standard Test Methodsfor Water Vapor Transmission of Materials. After the deposited dualacting epoxy-based layer of the invention was allowed to cure, acementitious self-leveling underlayment was poured directly over andonto such vapor barrier and primer cured layer. After drying, nodelamination was found between the cementitious self-levelingunderlayment and the present moisture vapor barrier and primerepoxy-based film of the invention. The present dual acting epoxy-basedfilms of the invention combine moisture mitigation and primer into asingle product, while eliminating the priming step at a job site.

EXAMPLE 2A Liquid Epoxy Resin Composition (Part A)

Composition/ Property Weight %* Liquid epoxy 58.4 wt. % resins Epoxyfunctional   5 wt. % reactive diluent Adhesion  1.0 wt. % promoterDefoamer  0.4 wt. % Wetting and  0.2 wt. % dispersing additive Mica   35wt. % TOTAL  100 wt. % FORMULATION *Range weight % based on total weightof resultant liquid epoxy resin composition (Part A)

EXAMPLE 2B Liquid Epoxy Curing Agent Composition (Part B)

Composition/ Property Weight %* Liquid epoxy 99.0 wt. % curing agentsAdhesion  1.0 wt. % promoter TOTAL  100 wt. % FORMULATION *Range weight% based on total weight of the liquid epoxy curing agent composition(Part B)

In Examples 2A and 2B, the Part A and Part B compositions were mixed atthe stoichiometric ratio of 3.4 to 1. The formulated dual actingepoxy-based liquid was applied to a concrete substrate using knowntechniques to a thickness of about 20 mil. The deposited dual actingepoxy-based liquid was allowed to fully cure to provide a cured dualacting epoxy-based film having both moisture vapor barrier propertiesand primer properties. In the resultant cured dual acting epoxy-basedfilm, the moisture vapor transmission rate was measured 0.08 perms at 20mil according to the water method of ASTM E 96 Standard Test Methods forWater Vapor Transmission of Materials. After the deposited dual actingepoxy-based layer of the invention was allowed to cure, a cementitiousself-leveling underlayment was poured directly over and onto such vaporbarrier and primer cured layer. After drying, no delamination was foundbetween the cementitious self-leveling underlayment and the presentmoisture vapor barrier and primer epoxy-based film of the invention. Thepresent dual acting epoxy-based films of the invention combine moisturemitigation and primer into a single product, while eliminating thepriming step at a job site.

EXAMPLE 3A Liquid Epoxy Resin Composition (Part A)

Composition/ Property Ingredient Weight %* Liquid epoxy an aliphatic94.20 wt. %  resins glycidyl ether reactive diluent, modified liquidepoxy resin Epoxy functional epoxidized 5.00 wt. % reactive diluentButanediol Defoamer naphtha 0.20 wt. % (petroleum) heavy alkylatedefoamer Wetting and silicone-modified 0.10 wt. % dispersing additivepolyacrylate Adhesion γ- 0.50 wt. % promoter Glycidoxypropyl- trimethoxysilane coupling agent TOTAL TOTAL  100 wt. % FORMULATION FORMULATION*Range weight % based on total weight of resultant liquid epoxy resincomposition (Part A)

EXAMPLE 3B Liquid Epoxy Curing Agent Composition (Part B)

Composition/ Property Ingredient Weight %* Epoxy curing solvent free40.00 wt. % agent 1 modified aliphatic amine Epoxy curing a modified59.00 wt. % agent 2 polyamine curing agent Adhesion diaminofunctional 1.00 wt. % promoter silane TOTAL 100%   100 wt. % FORMULATION *Rangeweight % based on total weight of the liquid epoxy curing agentcomposition (Part B)

In Examples 3A and 3B, the Part A and Part B compositions were mixed atthe stoichiometric ratio of 1.5 to 1. In accordance with Examples 3A and3B, the Part A and Part B compositions were stored at room temperature65-85° F. (18-30° C.) for 24 hours to ensure ease of mixing prior to usethereof. The two components were then mixed at a weight of 1.5 partliquid epoxy resin composition (Part A) to 1 part liquid epoxy curingagent composition (Part B) using a slow speed drill (<300 RPM) with ajiffy blade for about 2 minutes or until the mixture was fully uniformand all ribbons of contrasting shade/color are completely eliminated.The formulated dual acting epoxy-based liquid was applied to a concretesubstrate to a thickness of 16 mil using known techniques and cured toprovide a cured dual acting epoxy-based film of the invention havingboth moisture vapor barrier properties and primer properties. It wasfound that the resultant dual acting liquid epoxy-based formulation ofExamples 3A and 3B had an open time of about 30 minutes, a pot life ofabout 15 minutes, and once deposited, a time to foot traffic of about 3hours.

After the deposited dual acting epoxy-based layer of Examples 3A and 3Bwas allowed to cure, testing was performed on the film/layer of theinvention. Physical properties test results at room temperature areshown in the below table as follows:

Test Test method Results Vapor Permeance at 16 mil ASTM E96 0.094grains/h/ft²/in Hg thickness (5.4 ng/sec · m² · Pa) Tensile strengthASTM C1583 363 psi (2.5 MPa) Pull off Adhesion Strength ASTM D7234 660psi (4.6 MPa) Concrete substrate failure

In the resultant cured dual acting epoxy-based film, the moisture vaportransmission rate was measured 0.08 perms at 20 mil according to thewater method of ASTM E 96 Standard Test Methods for Water VaporTransmission of Materials. After the deposited dual acting epoxy-basedlayer of the invention was allowed to cure, a cementitious self-levelingunderlayment was poured directly over and onto such vapor barrier andprimer cured layer. After drying, no delamination was found between thecementitious self-leveling underlayment and the present moisture vaporbarrier and primer epoxy-based film of the invention. The present dualacting epoxy-based films of the invention combine moisture mitigationand primer into a single product, while eliminating the priming step ata job site.

Referring to the comparative test results depicted in FIG. 1 anddescribed below, prior art epoxy-based moisture mitigation layers, withand without primers, were tested and compared against the resultant dualacting liquid epoxy-based formulation of Examples 3A and 3B. The priorart epoxy-based Composition 1 (without primer) and Composition 2 (withprimer) products were each tested as moisture vapor barriers meetingASTM F3010 according to the test method of ASTM E96 of moisturemitigation system are used on concrete substrates. A cement basedself-leveling underlayment was deposited over the resultant film ofExamples 3A and 3B and the prior art Composition 1 and Composition 2. InComposition 2 the primer was applied using sand broadcast techniques toincrease the adhesion between the cement based self-levelingunderlayment and the epoxy moisture vapor barrier of Composition 2.

The three (3) different compositions were tested for adhesion failurebetween each deposited epoxy moisture vapor barrier and the overlyingcement based self-leveling layer. As shown in the below table, inComposition 1 (without primer) the adhesion strength was low, resultingin quick/easy adhesion failure between Composition 1 and theself-leveling layer. Composition 2 (with primer) had better results thanComposition 1, however, it has the added detrimental steps of applyingand cleaning a primer layer (e.g., via sand broadcast techniques). Theresultant dual acting epoxy-based film of Examples 3A and 3B of theinvention showed superior results over Compositions 1 and 2 by havingstronger tensile strength, with the added benefit of avoiding oreliminating the need for a primer step. The physical tensile strengthtest results performed at room temperature are shown in the followingtable:

Test Test method Results Tensile strength without primer ASTM C1583 102psi (0.70 MPa) Tensile strength with primer ASTM C1583 290 psi (2.0 MPa)Tensile strength ASTM C1583 363 psi (2.5 MPa)

Thus, the present invention provides dual acting epoxy-basedformulations that are single-coat, 100% solids, liquid appliedtwo-component part epoxy coatings that consolidate the application of amoisture barrier and primer from two-step application process into aone-step application process. It is suitable for use as an epoxy primerfor concrete prior to installing self-leveling underlayment products. Itis also suitable for use with various overlying layers including, butnot limited to, vinyl, rubber, VCT, carpet, wood, ceramic tile, stoneand other moisture sensitive floor coverings and flooring adhesives.Advantageously, the dual acting epoxy-based formulations may also bedeposited in a single step, and as such, requires no sand broadcast oradditional primers, thereby lowering costs.

While the present invention has been particularly described, inconjunction with a specific preferred embodiment, it is evident thatmany alternatives, modifications and variations will be apparent tothose skilled in the art in light of the foregoing description. It istherefore contemplated that the appended claims will embrace any suchalternatives, modifications and variations as falling within the truescope and spirit of the present invention.

Thus, having described the invention, what is claimed is:
 1. Atwo-component epoxy-based liquid formulation comprising: a liquid epoxyresin composition comprising one or more liquid epoxy resins containinga reactive oxirane structure or epoxide group; and a liquid epoxy curingagent composition comprising one or more epoxy curing agents, whereinthe liquid epoxy resin composition and the liquid epoxy curing agentcomposition are mixed together to provide a dual functioning epoxy-basedformulation that, when applied to a substrate and cured, simultaneouslyacts as both a moisture vapor barrier and a primer.
 2. The formulationof claim 1 wherein the reactive oxirane structure or epoxide group has astructure comprising


3. The formulation of claim 1 wherein the one or more liquid epoxyresins comprise one or more bisphenol based liquid epoxy resins selectedfrom the group consisting of a bisphenol-A liquid epoxy resin, adiglycidyl ether of bisphenol A, a bisphenol F, a liquid bisphenol-A/Fresin blend, and an aliphatic glycidyl ether reactive diluent, modifiedliquid epoxy resin.
 4. The formulation of claim 1 wherein the one ormore liquid epoxy resins comprise one or more C12-C14 aliphatic chainglycidyl ether reactive diluent, modified bisphenol-A/F based liquidepoxy resins.
 5. The formulation of claim 4 wherein the one or moreliquid epoxy resins comprise one or more C12-C14 aliphatic chainglycidyl ether reactive diluents having the reactive oxirane structureor epoxide group comprising diglycidyl ether of bisphenol A, orbisphenol F, or a liquid bisphenol-A/F resin blend.
 6. The formulationof claim 1 wherein the liquid epoxy resin composition further includes areactive or a non-reactive diluent comprising a bisphenol based liquidepoxy resin.
 7. The formulation of claim 6 wherein the bisphenol basedliquid epoxy resin is selected from the group consisting of a diglycidylether of bisphenol-A, a bisphenol-A liquid epoxy resin, a bisphenol-Fbased liquid epoxy resin, a liquid bisphenol-A/F resin blend, analiphatic glycidyl ether reactive diluent modified liquid epoxy resin,or an aliphatic glycidyl ether reactive diluent, modified liquid epoxyresin.
 8. The formulation of claim 1 wherein the liquid epoxy resincomposition further includes an epoxy functional reactive diluentselected from the group consisting of an aromatic glycidyl ether,aliphatic glycidyl ether, glycidyl amine, or glycidyl ether.
 9. Theformulation of claim 8 wherein the epoxy functional reactive diluent isa diglycidyl ether comprising 1,4 butanediol diglycidyl ether aliphaticdifunctional modifier that is an epoxy reactive diluent.
 10. Theformulation of claim 1 wherein the liquid epoxy resin compositionfurther includes additives selected from the group consisting ofadhesion promoters, defoamers, wetting and dispersing additives,pigments and fillers.
 11. The formulation of claim 1 wherein the liquidepoxy resin composition comprises; the one or more liquid epoxy resinscomprising one or more bisphenol based liquid epoxy resins; an epoxyfunctional reactive diluent comprising a diglycidyl ether; an adhesionpromoter comprising a γ-Glycidoxypropyl-trimethoxy silane couplingagent; a defoamer comprising a naphtha (petroleum) heavy alkylatedefoamer; a wetting and dispersing additive comprising a siliconeacrylate copolymer; pigment; and one or more fillers.
 12. Theformulation of claim 11 wherein the liquid epoxy resin compositioncomprises; the one or more liquid epoxy resins present in an amountranging from 80-100 wt. %, the epoxy functional reactive diluent presentin an amount ranging from 0-20 wt. %, the adhesion promoter present inan amount ranging from 0-3 wt. %, the defoamer present in an amountranging from 0-1 wt. %, the wetting and dispersing additive present inan amount ranging from 0-1 wt. %, the pigment present in an amountranging from 0-2 wt. %, the filler present in an amount ranging from0-20 wt. %, wherein the wt. % is based on a total weight of the liquidepoxy resin composition.
 13. The formulation of claim 1 wherein the oneor more epoxy curing agents of the liquid epoxy curing agent compositionare selected from the group consisting of liquid polyamines, polyamineadduct curing agents, and aliphatic amines.
 14. The formulation of claim1 wherein the liquid epoxy curing agent composition comprises a mixtureof a first epoxy curing agent being a solvent-free modified aliphaticamine and a second epoxy curing agent being a modified polyamine curingagent.
 15. The formulation of claim 1 wherein the liquid epoxy curingagent composition comprises; the one or more epoxy curing agentscomprising one or more liquid polyamine (R-NH₂) epoxy curing agents; acatalytic curing agent comprising tertiary amines; an adhesion promotercomprising diaminofunctional silanes; a defoamer; a wetting anddispersing additive; pigment; and one or more fillers.
 16. Theformulation of claim 15 wherein the liquid epoxy curing agentcomposition comprises; the one or more liquid epoxy resins present in anamount ranging from 80-100 wt. %, the catalytic curing agent present inan amount ranging from 0-5 wt. %, the adhesion promoter present in anamount ranging from 0-3 wt. %, the defoamer present in an amount rangingfrom 0-1 wt. %, the wetting and dispersing additive present in an amountranging from 0-1 wt. %, the pigment present in an amount ranging from0-2 wt. %, the filler present in an amount ranging from 0-20 wt. %,wherein the wt. % is based on a total weight of the liquid epoxy curingagent composition.
 17. The formulation of claim 1 wherein the liquidepoxy resin composition comprises; the one or more liquid epoxy resinsbeing one liquid epoxy resin comprising a mixture of: xirane,2,2′-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis-,homopolymer; a formaldehyde polymer having (chloromethyl)oxirane andphenol; and an alkyl (C12-14) glycidyl ether; a reactive diluent being abisphenol based liquid epoxy resin comprising oxirane,2,2′-[1,4-butanediylbis(oxymethylene)]bis; and a defoamer comprisingnaphtha (petroleum) heavy alkylate.
 18. The formulation of claim 17wherein the liquid epoxy curing agent composition comprises; the one ormore liquid epoxy resins comprising, a first epoxy curing agentcomprising a mixture of: 4-tert-butylphenol;4,6-Tri(dimethylaminomethyl)phenol; and methyl alcohol, and a secondepoxy curing agent comprising a mixture of: phenol 4-nonyl-branched;1,3-benzenedimethanamine; benzyl alcohol; and phenol; and an adhesionpromoter comprising a diaminofunctional silane.
 19. The formulation ofclaim 1 wherein the liquid epoxy resin composition and the liquid epoxycuring agent composition are mixed together in a stoichiometric ratioranging from 1.5:1.0 to 3.4:1.0 to provide the dual functioningepoxy-based formulation.
 20. The formulation of claim 1 wherein when thedual functioning epoxy-based formulation is applied to the substrate,the liquid epoxy resin composition and the liquid epoxy curing agentcomposition react with each other to provide a cured three-dimensionalcross-linked thermoset dual acting epoxy-based product having both themoisture vapor barrier and the primer functionalities.